Shanghai, April 14, 2026 – Today, AUDIOWELL officially held a product launch event in Shanghai, introducing system-level thermal solutions for AI computing infrastructure and embodied intelligence, and simultaneously unveiling its “O+X” strategic upgrade. This marks AUDIOWELL’s formal entry into the hundred-billion-yuan thermal management market for AI and embodied intelligence.
Three Core Products Precisely Target Thermal Pain Points
Three core products were launched at the event: an AI server liquid cooling thermal management dedicated flow sensor, a piezoelectric liquid pump, and a micro-jet fan – targeting the thermal pain points of computing servers, high-performance chips, and robot joints, respectively.
AI Server Liquid-Cooling Thermal Management Dedicated Flow Sensor: The “Sentinel” of Liquid Cooling Systems
With the widespread adoption of high-computing-power chips such as NVIDIA H100 – where single-chip power consumption exceeding 700W has become common – traditional air cooling is facing performance bottlenecks, and full liquid cooling technology is rapidly becoming the industry standard. This sensor adopts two technology routes: ultrasonic sensing and vortex sensing. The vortex flow sensor features algorithm optimizations specifically for bubble interference, a common issue in liquid cooling systems. Even under complex gas-liquid mixed conditions, it maintains high measurement accuracy of ±3%. With a fast response time of ≤1.5 seconds, it enables real-time monitoring of both main loop and branch loop flow, ensuring that data centers keep computing power chips “cool” under strict PUE requirements.
Notably, the intelligence of this sensor is reflected in two aspects: first, each sensor has its own MCU (microcontroller) with an embedded AI architecture; second, data flows bidirectionally – after the sensor transmits collected data to the CPU or GPU, newly trained algorithms can be sent back to the sensor via OTA updates, enabling continuous “evolution.”
Piezoelectric Liquid Pump: A Game-Changing Thermal Drive
Developed by AUDIOWELL based on the inverse piezoelectric effect, the piezoelectric liquid pump eliminates the traditional motor structure, reducing its size to just 7×7×1.4 mm, and consumes only one tenth the power of an electromagnetic pump. It achieves zero noise and no electromagnetic interference, providing a silent, interference free micro-sized thermal “heart” for smart terminals such as smartphones, computers, AR/VR devices, and other devices equipped with high-end chips.
Micro-Jet Fan: Breaking the Thermal Bottleneck of Robot Joints
Addressing the thermal challenges of embodied intelligent robots, AUDIOWELL has developed a micro-jet fan (MUAF). The internal space of humanoid robot joints is extremely limited, and when motors deliver bursts of power, they generate instantaneous high temperatures (up to 120-150°C). Traditional centrifugal fans with bearings are prone to wear and failure under high-frequency vibration. AUDIOWELL’s micro-jet fan fundamentally eliminates the fan bearing. Instead, it uses high-frequency vibration of piezoelectric ceramics to generate a directed jet of airflow, achieving effective heat dissipation. The fan is only 2.8 mm thick and weighs just 8.5 g, yet can generate back pressure as high as 300 Pa, rapidly reducing the internal joint temperature from the danger zone to a safe operating range of 60°C. Through future structural and process innovations, the thermal system is expected to achieve “lifetime maintenance-free” operation, ensuring long-term stable performance for robots.
System-Level Solution: Building an Intelligent Thermal Management System That “Extracts, Transports, and Dissipates Heat”
Facing the systemic challenges of thermal management – as chip heat flux density approaches physical limits and humanoid robots accelerate their deployment – AUDIOWELL leverages its more than 20 years of expertise in sensing and actuation technologies. By combining “sensing (sensors) + actuation (actuators),” the company has built an intelligent thermal management system that “extracts, transports, and dissipates heat.”
According to disclosed information, the above products have already been validated by leading industry customers. AUDIOWELL is cooperating with CDU (Coolant Distribution Unit) and robotics industry leaders, and the stability and heat dissipation efficiency of the products have been recognized by customers, marking the company’s initial positioning in this high growth thermal management market.
“O+X” Strategy Officially Launched – Embracing Infinite Possibilities in the AI Era
On the day of the launch, AUDIOWELL also formally announced its “O+X” strategic upgrade for the AI and embodied intelligence era. “O” (Original) represents AUDIOWELL’s traditional strong business areas: smart vehicles, smart homes, smart terminals, and smart manufacturing. “X” (Extension) represents the company’s expansion into AI infrastructure and core foundational hardware for embodied intelligence.
Zhang Shuguang, Chairman of AUDIOWELL, stated at the event: “As AI continues to evolve, the market demand for sensors and actuators will experience sustained long-term growth. AUDIOWELL will focus on the core needs of the perception and actuation layers of strong artificial intelligence, strengthening its systemic competitiveness across R&D, capital, and production capacity.” He further explained that the development of AI will go through three stages: improvement of algorithms and computing power; popularization of intelligent assistants and embodied intelligence; and digitalization of physical space. AUDIOWELL is developing sensors along this roadmap: the current focus is on computing scenarios, the next step is embodied intelligence, and the following step is spatial intelligence.
A Significant Entry into a Hundred-Billion-Yuan Market
According to Frost & Sullivan forecasts, the global thermal management solutions market will exceed RMB 400 billion by 2029, with a compound annual growth rate of over 20%. This product launch not only signifies AUDIOWELL’s formal entry into the hundred-billion-yuan AI and embodied intelligence thermal management market but also announces the company’s strategic transformation from a sensor and actuator manufacturer to a provider of core hardware for AI and embodied intelligence.
This is an important breakthrough for a Chinese sensor company in the construction of AI physical layer infrastructure. Looking ahead, AUDIOWELL will continue to focus on core needs surrounding strong artificial intelligence, using its sensing and actuation technologies to build the foundational hardware for the AI era, and contributing China’s strength to the development of global AI infrastructure and the embodied intelligence industry.
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