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Innovation Revolution in Thermal Management Under the AI Computing Wave: Audiowell Piezoelectric Micro-pump Liquid Cooling Solution Officially Released!

2025-12-02 Product Information

With the rapid development of AI algorithms and high-performance computing equipment, the thermal dissipation challenges of electronic devices—represented by smart terminals and servers—are becoming increasingly severe. The surge in computational intensity has led to a sharp increase in heat flux density, pushing traditional cooling methods gradually toward their physical limits.

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From terminal devices to edge computing nodes, and further to data centers with a "device-edge-cloud" collaborative computing architecture, these have become the foundation supporting the development of new-generation information technologies such as artificial intelligence and big data.

However, the improvement in computing capability is often accompanied by a simultaneous increase in power consumption and heat generation. Particularly with the deployment of large-scale models and complex AI algorithms, the thermal dissipation demands for mobile devices and high-density servers have become urgent. High heat density not only affects the stable performance release of devices but also concerns chip lifespan, system reliability, and user experience. Therefore, developing efficient, compact, and low-energy advanced cooling technologies has become a critical bottleneck for the industry to overcome. This is precisely why the Audiowell Piezoelectric Micro-pump Liquid Cooling Solution has emerged—an innovative achievement based on the deep integration of the inverse piezoelectric effect and microfluidics technology.

The core component of the Audiowell Piezoelectric Micro-pump Liquid Cooling Solution—the piezoelectric liquid pump—utilizes the characteristic deformation of piezoelectric ceramic materials under an electric field to drive precise and continuous flow of the working medium within the cavity, thereby constructing an efficient active circulating liquid cooling system.

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Core Component of the Solution: Piezoelectric Liquid Pump

Compact Size
The piezoelectric liquid pump achieves millimeter-scale thickness, and the overall solution features a small and compact volume, making it highly suitable for integration into various smart terminal devices sensitive to space constraints.

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Reference image: Piezoelectric liquid pump compared to the size of a 1-yuan coin.

High Pressure Output
Despite its tiny size, this pump can provide the working pressure required for system circulation, ensuring stable flow of the coolant through complex micro-channel networks.

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Low Power Consumption
The product operates with power consumption ≤15 mW. While significantly enhancing cooling capability, it has almost no impact on the overall device power budget, making it particularly suitable for battery-powered mobile devices.

 


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